Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-01-28
2001-10-09
Sircus, Brian (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
06301120
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to electrical circuit board apparatuses and construction of components using electrical circuit board apparatuses. The present invention is especially directed to electrical circuit board apparatuses employed in constructing power supply circuits.
Current technology relating to circuit board construction, and especially relating to circuit board construction for high packaging density power supply components, places all control circuitry onto a double-sided surface-mounted control printed wiring board (PWB) to form a control module. Power circuitry is placed onto an insulated metal substrate (IMS) to form a power module. The two modules are assembled to form a power supply component. Assembly of the two modules is usually effected by stacking the two modules to physically combine them. Electrical connections between the two stacked modules are accomplished by pin arrangements or by wiring arrangements. Present technology for insulated metal substrate (IMS) circuit boards contemplates either single-layer or two-layer copper traces on one side of a metal substrate. No components are applied to the second side of the metal substrate; no circuit connections are made between the two sides of the metal substrate.
Integration of circuitry and increases in efficiency of circuitry enable design of circuits that do not require heat sinks for heat dissipation. Circuits with a metal substrate efficiently dissipate the heat generated and may be sufficiently cooled with air flow on the order of 300 linear feet per minute about the circuit.
There is a need for more compact and simpler construction of electronic circuitry, especially for electronic power circuitry. Component construction is desirable that advantageously employs recent improvements in integration and efficiency of electronic parts and components.
SUMMARY OF THE INVENTION
An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side electrically conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side. The second-side laminar structure includes at least one second-side electrically conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.
By such construction as is contemplated by the preferred embodiment of the present invention, compact, efficient, and thermally enhanced electronic components may be fashioned. Such favorable component characteristics are especially desirable in power electronic components.
It is, therefore, an object of the present invention to provide an improved circuit board apparatus configured for mounting electronic components in a circuit arrangement that is space-efficient and improved thermal characteristics.
It is a further object of the present invention to provide an improved electrical circuit apparatus using circuit board technology according to the present invention for advantage in space-efficiency and improved thermal characteristics.
Further objects and features of the present invention will be apparent from the following specification and claims when considered in connection with the accompanying drawings, in which like elements are labeled using like reference numerals in the various figures, illustrating the preferred embodiments of the invention.
REFERENCES:
patent: 4866571 (1989-09-01), Butt
Chen Shiaw-Jong Steve
Hooey Roger J.
Truong Thang D.
Law office of Donald D. Mondul
Lucent Technologies - Inc.
Prasad Chandrika
Sircus Brian
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