Circuit board and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S723000, C257S724000, C361S782000, C361S783000

Reexamination Certificate

active

07619296

ABSTRACT:
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface of the multilayered interconnect structure; and a spiral inductor formed to enclose the terminal for flip-chip packaging, in a plan view, which is not electrically connected with the spiral inductor. The spiral inductor may be provided for peaking by which the gain reduction caused in a high frequency is compensated.

REFERENCES:
patent: 5450263 (1995-09-01), Desaigoudar et al.
patent: 7038294 (2006-05-01), Ma et al.
patent: 7348654 (2008-03-01), Hsieh et al.
patent: 7355290 (2008-04-01), Shioga et al.
patent: 2003/0141919 (2003-07-01), Wang et al.
patent: 2005/0160575 (2005-07-01), Gambino et al.
patent: 10-335590 (1998-12-01), None
patent: 11-340420 (1999-12-01), None
patent: 2002-124638 (2002-04-01), None
patent: 2004-274463 (2004-09-01), None

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