Circuit board and sealing structure and methods for manufacturin

Electric heating – Metal heating – By arc

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Details

21912182, 21912183, B23K 2602, B23K 2608

Patent

active

052626148

ABSTRACT:
A circuit board is manufactured by a method having the steps of depositing a metal pattern on a ceramic board, depositing a thin layer of a high polymer material on the ceramic board formed with the metal pattern, depositing a protective layer of a high polymer material on the thin layer of the high polymer material, and directing a laser beam toward and onto the protective layer and the thin layer deposited on a plating region of the metal pattern and a cutting region of the ceramic board thereby selectively removing part of those layers. The laser beam has a wavelength range of from 150 nm to 400 nm, an energy density range of from 0.5 J/cm.sup.2 to 5.0 J/cm.sup.2, and a pulse width range of from 100 ps to 1 .mu.s.

REFERENCES:
patent: 4630491 (1986-12-01), Kitagawa et al.
patent: 4874920 (1989-10-01), Yamazaki et al.
patent: 4928838 (1990-05-01), Imamura
patent: 5008582 (1991-04-01), Tanuma et al.
Thomas A. Znotins et al. "Excimer Laser: An Emerging Technology in Materials Processing", Laser Focus/Electro-Optics, pp. 54, 56 58,60 and 63, May 1987.
Proceedings of the 3rd European Conference on Laser Treatment of Materials, Sep. 1990 vol. pp. 825-834.

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