Circuit board and processing method thereof

Details Circuit board and processing method thereof Circuit board and processing method thereof

2006-12-05

2006-12-05

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000

Reexamination Certificate

active

07143509

ABSTRACT:
A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second plated through hole is disclosed. The first laminated structure has at least three first circuit layers and at last two first dielectric layers. The first circuit layers and the first dielectric layers are alternately laminated and any two adjacent first circuit layers have a first dielectric layer disposed between them. The first plated through hole passes through the first laminated layer. The second laminated structure is laminated over the first laminated structure. The middle dielectric layer is disposed between the first laminated structure and the second laminated structure. The second plated through hole passes through the first laminated structure, the middle dielectric layer and the second laminated structure.

REFERENCES:
patent: 4915983 (1990-04-01), Lake et al.
patent: 5567329 (1996-10-01), Rose et al.
patent: 5731047 (1998-03-01), Noddin
patent: 5863446 (1999-01-01), Hanson
patent: 5868950 (1999-02-01), Noddin
patent: 5910255 (1999-06-01), Noddin
patent: 6376049 (2002-04-01), Asai et al.
patent: 6376052 (2002-04-01), Asai et al.
patent: 6413620 (2002-07-01), Kimura et al.
patent: 6534723 (2003-03-01), Asai et al.
patent: 6768061 (2004-07-01), Kondo
patent: 6849945 (2005-02-01), Horiuchi et al.
patent: 6930258 (2005-08-01), Kawasaki et al.

Affiliated with

Also associated with

Rating

Circuit board and processing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and processing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and processing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3694272