Circuit board and process for producing the same

Details Circuit board and process for producing the same Circuit board and process for producing the same

1989-09-18

1991-06-04

Ryan, Patrick J.

Stock material or miscellaneous articles

Surface property or characteristic of web, sheet or block

428209, 428457, 428901, 361397, B32B 900

Patent

active

050212966

ABSTRACT:
A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.

REFERENCES:
patent: 4642161 (1987-02-01), Akahashi et al.
patent: 4696861 (1987-09-01), Tatematsu et al.
patent: 4774122 (1988-09-01), Adler
patent: 4806432 (1989-02-01), Eguchi et al.
Jap. Pat. Abs. 52-079271, 7-4-77, Fujitsu.

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