Circuit board and process for manufacturing same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174259, 174264, H05K 100

Patent

active

051533847

ABSTRACT:
A circuit board comprising a base having a substantially flat surface and an insulative layer made of a heat-resisting synthetic resin formed on the flat surface of the base. The insulative layer is provided with grooves for forming conductive parts, and each of the groove is defined by a bottom surface formed by the base and side walls formed by the insulative layer. A conductive adhesive layer having a good adhesion characteristic with respect to the base, such as Cr, is formed on the bottom surface of the grooves, and a conductive layer is formed on the conductive adhesive layer so that a surface defined by the insulative layer and the conductive parts including the conductive layer and conductive adhesive layer is substantially flat.

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Poley, N. M.; Cermet Protective Layer at Metal-Dielectric overcoat Interface, IBM Technical Disclosure Bulletin, vol. 15 No. 10 Mar. 1973.
Kolly, J. M. and T. D. Zucconi, Laminated PC Board System, IBM Technical Disclosure Bulletin, vol. 21 No. 6 Nov. 1978.
Greer, S. E. Fabrication of Solid Via Structures in Organic Polymers, IBM Technical Disclosure Bulletin, vol. 19, No. 3 Aug. 1976.
E. J. Webb, F. J. Bolda, T. J. Walsh, Flush Molding of Printed Circuitry, IBM Technical Disclosure Bulletin vol. 8, No. 8 Jan. 1966.

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