Circuit board and method of manufacturing the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C361S792000, C439S066000

Reexamination Certificate

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10203970

ABSTRACT:
A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

REFERENCES:
patent: 4663497 (1987-05-01), Reimann
patent: 5185502 (1993-02-01), Shepherd et al.
patent: 5514326 (1996-05-01), Tani et al.
patent: 5627345 (1997-05-01), Yamamoto et al.
patent: 6077415 (2000-06-01), Duruz et al.
patent: 6087597 (2000-07-01), Shimada et al.
patent: 6465742 (2002-10-01), Hiraoka et al.
patent: 6479763 (2002-11-01), Igaki et al.
patent: 6555763 (2003-04-01), Hirasawa et al.
patent: 6641898 (2003-11-01), Yazaki et al.
patent: 6713687 (2004-03-01), Yazaki et al.
patent: 6713688 (2004-03-01), Kokufu et al.
patent: 6730856 (2004-05-01), Furukuwa
patent: 6972070 (2005-12-01), Yazaki et al.
patent: 1361655 (2002-07-01), None
patent: 11251703 (1999-09-01), None
patent: 0 955 795 (1999-11-01), None
patent: 7-115255 (1995-05-01), None
patent: 11-251703 (1999-09-01), None
Machine Translation of JP11-251703.
State Intellectual Property Office of People's Republic of China; “The Third Office Action” re: Appl. No. 02800069.2, w/ English translation; Issuing Date: Jan. 20, 2006; 6 Pages.
Micropatent Family Available Check; MicroPatent® Family Lookup; Feb. 1, 2006; 3 Pages.

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