Circuit board and method of manufacturing the same

Details Circuit board and method of manufacturing the same Circuit board and method of manufacturing the same

2007-11-06

2007-11-06

Toledo, Fernando L. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S773000, C257S775000, C257S780000, C257SE23010

Reexamination Certificate

active

11203124

ABSTRACT:
A circuit board includes an insulating substrate, a first conductive layer on the insulating substrate, a second conductive layer on the first conductive layer, and a third conductive layer covering the first conductive layer and the second conductive layer. The first conductive layer has a surface provided on the surface of the insulating substrate, and a surface having a width smaller than a width of the above surface. In this circuit board, the conductive layers have small impedances even if a high-frequency signal flows in the conductive layers.

REFERENCES:
patent: 4442137 (1984-04-01), Kumar
patent: 4700473 (1987-10-01), Freyman et al.
patent: 6365843 (2002-04-01), Shirai et al.
patent: 6434818 (2002-08-01), Kanechika et al.
patent: 6436735 (2002-08-01), Goetz et al.
patent: 2004/0099961 (2004-05-01), Chu et al.
patent: 2004-095983 (2004-03-01), None

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