Circuit board and method of manufacturing the same

Details Circuit board and method of manufacturing the same Circuit board and method of manufacturing the same

2007-11-20

2007-11-20

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

10918274

ABSTRACT:
Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

REFERENCES:
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5875100 (1999-02-01), Yamashita
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6300686 (2001-10-01), Hirano et al.
patent: 6512182 (2003-01-01), Takeuchi et al.
patent: 6623844 (2003-09-01), Nishimoto
patent: 6709897 (2004-03-01), Cheng et al.
patent: 6768064 (2004-07-01), Higuchi et al.
patent: 6909054 (2005-06-01), Sakamoto et al.
patent: 7087991 (2006-08-01), Chen et al.
patent: 62-70473 (1987-05-01), None
patent: 2001-093934 (2001-04-01), None

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