Circuit board and method of manufacturing the same

Details Circuit board and method of manufacturing the same Circuit board and method of manufacturing the same

2011-07-26

2011-07-26

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S361000

Reexamination Certificate

active

07985929

ABSTRACT:
A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of through holes penetrating the multilayer board; cylindrical recesses each formed around a through hole corresponding thereto, having a diameter larger than that of the through hole, having a depth from an outermost surface of the insulating layer to a surface of the conductive layer for electrical connection, and partially exposing the surface of the predetermined conductive layer; and a plurality of conductive terminals fitted into the through holes.

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Japanese Office Action dated May 31, 2011 corresponding to Japanese Patent Application No. 2006-235609.

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