Circuit board and method of manufacturing same

Details Circuit board and method of manufacturing same Circuit board and method of manufacturing same

2006-02-07

2006-02-07

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000

Reexamination Certificate

active

06993836

ABSTRACT:
A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

REFERENCES:
patent: 4967314 (1990-10-01), Higgins, III
patent: 5072075 (1991-12-01), Lee et al.
patent: 5200580 (1993-04-01), Sienski
patent: 5219639 (1993-06-01), Sugawara et al.
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5259110 (1993-11-01), Bross et al.
patent: 5276955 (1994-01-01), Noddin et al.
patent: 5315072 (1994-05-01), Arai et al.
patent: 5350886 (1994-09-01), Miyazaki et al.
patent: 5478972 (1995-12-01), Mizutani et al.
patent: 5517751 (1996-05-01), Bross et al.
patent: 6528733 (2003-03-01), Takenaka et al.
patent: 6532651 (2003-03-01), Andou et al.
patent: 6630630 (2003-10-01), Maezawa et al.
patent: 6748652 (2004-06-01), Andou et al.
patent: 6839964 (2005-01-01), Henson
patent: 0 793 405 (1997-09-01), None
patent: 0 961 533 (1999-12-01), None
patent: 07-147464 (1995-06-01), None
patent: 08-78803 (1996-03-01), None
patent: 8-316598 (1996-11-01), None
patent: 10-56267 (1998-02-01), None
patent: 11-087870 (1999-03-01), None
patent: 2000-156566 (2000-06-01), None

Affiliated with

Also associated with

Rating

Circuit board and method of manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and method of manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and method of manufacturing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3684748