Circuit board and method of manufacturing same

Details Circuit board and method of manufacturing same Circuit board and method of manufacturing same

2011-03-22

2011-03-22

Levi, Dameon E (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S783000, C174S263000, C174S534000, C174S538000, C174S557000, C174S558000

Reexamination Certificate

active

07911804

ABSTRACT:
The present invention provides a circuit board and a method for manufacturing the circuit board, the circuit board and method allowing a further shorter connection distance between electrodes of a semiconductor device, and also allowing a sufficient thickness of a solder pre-coat in a soldering process. The circuit board comprises bonding pads for being connected with bumps of a semiconductor element, which act as connection terminals, the bonding pads being arrayed in parallel lines on a surface of the circuit board, and, on the adjacent parallel lines, the bonding pads being positioned to form a zigzag pattern along the parallel lines longitudinally.

REFERENCES:
patent: 5719449 (1998-02-01), Strauss
patent: 6222738 (2001-04-01), Maeno et al.
patent: 6229711 (2001-05-01), Yoneda
patent: 6556454 (2003-04-01), D'Amato et al.
patent: 6700208 (2004-03-01), Yoneda
patent: 60-218751 (1985-11-01), None
patent: 7-074459 (1995-03-01), None
patent: 9-293957 (1997-11-01), None
patent: 2001-127198 (2001-05-01), None
patent: 2005-011902 (2005-01-01), None

Affiliated with

Also associated with

Rating

Circuit board and method of manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and method of manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and method of manufacturing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2680597