Circuit board and method of manufacturing circuit board

Details Circuit board and method of manufacturing circuit board Circuit board and method of manufacturing circuit board

2006-09-28

2010-06-15

Lam, Cathy (Department: 1794)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C428S209000, C428S901000

Reexamination Certificate

active

07737368

ABSTRACT:
A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.

REFERENCES:
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5972482 (1999-10-01), Hatakeyama et al.
patent: 6518515 (2003-02-01), Nishii et al.
patent: 1248881 (2000-03-01), None
patent: 2-194689 (1990-08-01), None
patent: 05-055401 (1993-03-01), None
patent: 5-235544 (1993-09-01), None
patent: 2002-232102 (2002-08-01), None
patent: 2002-237681 (2002-08-01), None
patent: 2002-299784 (2002-10-01), None
patent: 2005-086164 (2005-03-01), None

Affiliated with

Also associated with

Rating

Circuit board and method of manufacturing circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and method of manufacturing circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and method of manufacturing circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4216157