Circuit board and method of fabricating the same

Details Circuit board and method of fabricating the same Circuit board and method of fabricating the same

2007-09-12

2010-02-23

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

07667144

ABSTRACT:
A circuit board including a dielectric layer, a circuit layer, at least one conductive joint column, and a solder mask layer is provided. The circuit layer having at least one pad is in contact with the dielectric layer. The conductive joint column is disposed on the pad. The solder mask layer is disposed on the dielectric layer and covers the circuit layer. The solder mask layer is in contact with the conductive joint column, and the conductive joint column penetrates the solder mask layer. A height of the conductive joint column is larger than a thickness of the solder mask layer. The enhanced reliability of bonding between another component and the conductive joint column will be provided. Further, a method of fabricating a circuit board is also provided.

REFERENCES:
patent: 6028357 (2000-02-01), Moriyama
patent: 6413849 (2002-07-01), Yeoh et al.
patent: 6700079 (2004-03-01), Bogursky et al.
patent: 7068520 (2006-06-01), Miyamoto et al.

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