Circuit board and method for producing same

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

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Details

156153, 156247, 156250, 427259, 427386, 427385R, 427409, 427410, B05D 512, B05D 132, B05D 302

Patent

active

040911250

ABSTRACT:
There is disclosed a method for producing an electrical circuit board comprising the steps of selectively treating a portion of a conductive metal sheet in a pattern substantially corresponding to a predetermined printed circuit configuration and in a manner which renders the pattern portion of the sheet essentially adherent to a resin, placing the treated pattern portion of the sheet in direct contact with a layer of resin on the surface of an insulating substrate to form an assembly, uniformily heating the assembly to an elevated temperature to selectively bond the substrate to the treated pattern portion of the sheet, cutting the sheet along the perimeter of the pattern portions and stripping the non-pattern portions of the sheet from the substrate to form a circuit board.

REFERENCES:
patent: 2728693 (1955-12-01), Cado
patent: 3467540 (1969-09-01), Schick
patent: 3547724 (1970-12-01), Zagusta
patent: 3713944 (1973-01-01), Dennis et al.
patent: 3948701 (1976-04-01), Fasbenber et al.
patent: 3950570 (1976-04-01), Kenny
patent: 4012552 (1977-03-01), Watts

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