Circuit board and method for manufacturing the same and...

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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C174S557000, C174S558000, C174S260000, C174S261000, C257S737000, C257S775000, C361S767000

Reexamination Certificate

active

10833972

ABSTRACT:
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

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Form PTO 892, from co-pending U.S. Appl. No. 11/146,610, mailed Apr. 13, 2007.
Taiwanese Office Action from the corresponding Taiwanese application 094109385, mailed Apr. 17, 2007.

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