Circuit board and method for manufacturing the same

Details Circuit board and method for manufacturing the same Circuit board and method for manufacturing the same

2009-10-14

2010-10-26

Le, Uyen-Chau N (Department: 2874)

Optical waveguides

Integrated optical circuit

C257S758000, C257S774000, C361S748000, C361S772000

Reexamination Certificate

active

07822302

ABSTRACT:
Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

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Japanese Office action issued in Japanese Patent Application No. 2006-049345 on Oct. 27, 2009.

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