Circuit board and method for manufacturing same

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428192, B32B 300, B32B 2302

Patent

active

060226110

ABSTRACT:
A circuit board capable of accomplishing an increase in current capacity and therefore a reduction in resistance of a through-hole conductive section each formed by filling a conductive paste in each of through-holes formed in a paper base insulating substrate by punching. A punching pin is thrust into the paper base insulating substrate provided on front and rear surfaces thereof with copper foil lands from a side of the front surface, resulting in the through-holes being formed. A drawing pin is inserted into each of the through-holes from a side of the rear surface of the insulating substrate through a rear opening of the through-hole, to thereby curve an inner peripheral portion of the rear copper foil land toward an interior of the through-hole and cut off any swell in the through-hole. The through-holes each are filled with the conductive paste, followed by curing the paste, so that the through-hole conductive section is formed for electrically connecting copper foil lands to each other.

REFERENCES:
patent: 4029845 (1977-06-01), Nomura
patent: 4486505 (1984-12-01), Fushiki et al.
patent: 4578308 (1986-03-01), Hani et al.
patent: 5131141 (1992-07-01), Kawaguchi
patent: 5346750 (1994-09-01), Hatakeyama et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit board and method for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and method for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and method for manufacturing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1679347

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.