Circuit board and method for fabricating the same

Details Circuit board and method for fabricating the same Circuit board and method for fabricating the same

2008-08-08

2011-11-15

Chervinsky, Boris (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S258000, C174S259000, C361S767000

Reexamination Certificate

active

08058568

ABSTRACT:
A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer.

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patent: 2006/0180344 (2006-08-01), Ito et al.

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