Circuit board and method for fabricating the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S258000, C174S259000, C361S767000

Reexamination Certificate

active

08058568

ABSTRACT:
A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer.

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patent: 6329610 (2001-12-01), Takubo et al.
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6742250 (2004-06-01), Takahashi
patent: 6759318 (2004-07-01), Chang
patent: 7071424 (2006-07-01), Shirai et al.
patent: 7446263 (2008-11-01), En
patent: 7690109 (2010-04-01), Mori et al.
patent: 2006/0180344 (2006-08-01), Ito et al.

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