Circuit board and method

Details Circuit board and method Circuit board and method

1997-07-20

1999-07-27

Meier, Stephen D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257 81, 257 99, 257432, 257433, 257415, H01L 2334, H01L 2715, H01L 310232, H01L 310203

Patent

active

059295180

ABSTRACT:
A circuit board (10, 50, 70) and method transport a conduction medium (75) through the circuit board for operating a semiconductor device (16, 60, 77, 79) supported on a surface (15, 62, 82) of the circuit board. A medium transport cavity (20, 36, 54, 80) is formed in the circuit board such that a portion (36, 54, 80) runs parallel to the surface, and therefore has a length greater than the thickness of the circuit board. The conduction medium can include air, a coolant fluid, or an optical fiber, which can transport energy such as pressure/vacuum, sound, heat or light from an external source to the semiconductor device.

REFERENCES:
patent: 4706164 (1987-11-01), L'Henaff et al.
patent: 4809134 (1989-02-01), Tustaniwskyj et al.
patent: 4945400 (1990-07-01), Blonder et al.
patent: 5262921 (1993-11-01), Lamers
patent: 5522002 (1996-05-01), Chur et al.
patent: 5611006 (1997-03-01), Tabuchi

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