Circuit board and manufacturing method thereof

Details Circuit board and manufacturing method thereof Circuit board and manufacturing method thereof

2008-08-18

2011-11-15

Datskovskiy, Michail V (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S263000, C174S264000, C174S261000, C361S708000, C361S719000, C361S795000, C257S698000, C257S758000, C257S774000, C428S209000, C428S131000, C029S829000, C029S830000, C029S846000, C029S852000

Reexamination Certificate

active

08058561

ABSTRACT:
A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.

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Chinese First Examination Report of China Application No. 200810082126.2, dated Aug. 3, 2010.

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