Circuit board and manufacturing method thereof

Details Circuit board and manufacturing method thereof Circuit board and manufacturing method thereof

2011-03-01

2011-03-01

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S810000, C361S720000

Reexamination Certificate

active

07898820

ABSTRACT:
A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.

REFERENCES:
patent: 4851614 (1989-07-01), Duncan, Jr.
patent: 5326937 (1994-07-01), Watanabe
patent: 5414223 (1995-05-01), Suski et al.
patent: 5420378 (1995-05-01), Estes et al.
patent: 5668699 (1997-09-01), Bell et al.
patent: 6295210 (2001-09-01), Lanzone et al.
patent: 6497923 (2002-12-01), Baalmann et al.
patent: 6710258 (2004-03-01), Oggioni et al.

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