Circuit board and its manufacturing method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S763000, C361S766000, C361S793000, C361S782000, C361S821000

Reexamination Certificate

active

10727650

ABSTRACT:
A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.

REFERENCES:
patent: 5874770 (1999-02-01), Saia et al.
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6356455 (2002-03-01), Carpenter
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6806428 (2004-10-01), Kimura et al.
patent: 2003/0221864 (2003-12-01), Bergstedt et al.
patent: 2004/0037061 (2004-02-01), Liu et al.
patent: 2004/0150966 (2004-08-01), Hu
patent: 2001-53413 (2001-02-01), None
patent: 2001-93934 (2001-04-01), None

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