Circuit board and component manipulation device

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 20, 219373, B23K 112

Patent

active

046103880

ABSTRACT:
A circuit board and component manipulation device includes a housing having a circuit board clamp located thereon for positioning a circuit board on the housing. Hot gas for soldering or desoldering operations can be directed to components on the circuit board from one or the other of both an upper gas duct and a lower gas duct, both of which are fed gas from a blower. Each of the ducts include an individual heater located therein so as to control heat input to the gas passing through the ducts. The upper duct terminates in a discharge head which includes a nozzle attached thereto. The nozzle includes an appropriate opening so as to receive a circuit component. The opening is surrounded by a skirt with the gas ducts then positioned outwardly from the skirt. By positioning the component within the skirt, the component is isolated from hot gas utilized for soldering or desoldering of the connectors of the component to an appropriate circuit board.

REFERENCES:
patent: 3420430 (1969-01-01), Goetz et al.
patent: 3422247 (1969-01-01), Royston et al.
patent: 3524247 (1970-08-01), Goldschmied
patent: 3611561 (1971-10-01), Dosier
patent: 3644980 (1972-02-01), Class, Jr. et al.
patent: 3661315 (1972-05-01), Helton
patent: 4066204 (1978-01-01), Wirbser et al.
patent: 4193160 (1980-03-01), Vandermark
patent: 4295596 (1981-10-01), Doten et al.
patent: 4426571 (1984-01-01), Beck
patent: 4552300 (1985-11-01), Zovko et al.
IBM Technical Disclosure Bulletin, vol. 11, No. 10, Mar. 1969, 1298.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit board and component manipulation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board and component manipulation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board and component manipulation device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1011712

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.