Circuit board and circuit board connection structure

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S254000, C174S262000

Reexamination Certificate

active

07417195

ABSTRACT:
A printed circuit board2and an FPC board3to be connected together are each given a multilayer structure wherein insulating films23, 33and interconnection patterns22, 32are stacked alternately. In the FPC board3, connecting signal lines are distributed among the multilayered interconnection patterns22, and in the printed circuit board2, interconnecting to lands32aformed on a connection face thereof is carried out using interconnection patterns32of inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit board2and the FPC board3.

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patent: A-04-177864 (1992-06-01), None
patent: A-06-6006 (1994-01-01), None
patent: A-09-506206 (1997-06-01), None
patent: A-2000-312061 (2000-11-01), None
patent: A-2001-085840 (2001-03-01), None

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