Circuit board adapted to receive a single in-line package module

Details Circuit board adapted to receive a single in-line package module Circuit board adapted to receive a single in-line package module

1994-09-30

1996-01-16

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 439 59, 439 62, 439 65, H05K 114

Patent

active

054849659

ABSTRACT:
A mounting for a single in-line package (SIP) module includes an elongated slot aperture for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated slot aperture preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The aperture is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the aperture with an interference or size-on-size fit. The aperture may include strain relief areas.

REFERENCES:
patent: 3993936 (1976-11-01), Meade et al.

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