Circuit board

Details Circuit board Circuit board

1989-01-24

1990-10-16

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

H05K 100

Patent

active

049637010

ABSTRACT:
Disclosed is an aluminum nitride thin film circuit board having an aluminum nitride substrate and a conductive thin film pattern formed on the substrate. The conductive thin film pattern has a multi-layer structure selected from the group consisting of Ti/Ni/Au, Ti/Pd/Au, Ti/Pt/Au, Ni/Au, Cr/Au, and Cr/Cu/Au, and a boundary layer of Al-N-M-O (M is Ti, Ni, or Cr) is formed between the substrate and the conductive thin film pattern. Since the boundary layer is formed, bonding properties between the substrate and the conductive thin film pattern are improved. In particular, when the boundary layer contains 0.02 to 30 atomic % of oxygen, a higher bonding strength can be obtained.

REFERENCES:
patent: 4470059 (1984-09-01), Nishizawa et al.
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4571610 (1986-02-01), Matsushita et al.
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4737757 (1988-04-01), Senda et al.
patent: 4783716 (1988-11-01), Nagase et al.
Development of Highly Thermal Conductive AlN Substrate by Green Sheet Technology, IEEE 1986, Kurokawa et al.

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