Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1993-01-28
1994-07-05
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428209, 428901, B32B 900
Patent
active
053266234
ABSTRACT:
A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
REFERENCES:
patent: 5041700 (1991-08-01), Iyogi et al.
Proceedings of 1986 VMIC Conference, C.-K. Hu, et al., pp. 181-187, Jun. 9-10, 1986, "Diffusion Barrier Studies for CU."
Proceedings of 1989 VMIC Conference, K. Hoshino, et al., pp. 226-233, Jun. 12-13, 1989, "Tin-Encapsulized Copper Interconnects for ULSI Applications."
Microelectronics Packaging Handbook, Chp. 9, Sec. 6, 1989, R. O. Tummala, et al., "Thin-Film Materials and Processes."
Iwase Nobuo
Iyogi Kiyoshi
Koiwa Kaoru
Yamakawa Koji
Yasumoto Taka-aki
Kabushiki Kaisha Toshiba
Lee Kam
Ryan Patrick J.
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