Circuit board

Details Circuit board Circuit board

1993-07-06

1996-07-23

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, H05K 109

Patent

active

055391818

ABSTRACT:
A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the holes. To this end, the surface structure of the circuit board, in particular the conductors, are initially completed, covered with a solder stop mask, and it is only then that the holes bared by exposure and development of the solder stop mask and, if required, lands and pads, are metallized.

REFERENCES:
patent: 2897409 (1959-07-01), Gitto
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3799816 (1974-03-01), Schneble et al.
patent: 4572925 (1986-02-01), Scarlett
patent: 4633035 (1986-12-01), McMonagle
patent: 5001605 (1991-03-01), Savagian et al.
patent: 5276290 (1994-01-01), Bladon
patent: 5319159 (1994-06-01), Wantanabe et al.
Patent Abstracts of Japan vol. 14, No. 182 Apr. 12, 1990 "Manufacturing of Printed Wiring Board" 2-32589.
Patent Abstracts of Japan vol. 14, No. 22 Jan. 17, 1990 "Manufacturing of Printed Wiring Board" 1-264290.

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