Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-04-13
2011-10-11
Nguyen, Hoa C (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S780000, C361S794000, C361S799000, C361S816000
Reexamination Certificate
active
08035993
ABSTRACT:
A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.
REFERENCES:
patent: 2004/0124940 (2004-07-01), Ryu et al.
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patent: 2005/0205292 (2005-09-01), Rogers et al.
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Article Titled “A Novel Power Plane With Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface” jointly authored by Kamgaing et al., in IEEE, vol. 13, No. 1, Jan. 2003 (pp. 21-23).
Article Titled “High-Impedance Electromagnetic Surfaces with a Forbidden Frequency Band” jointly authored by Sievenpiper et al., in IEEE, vol. 47, No. 11, Nov. 1999 (pp. 2059-2074).
Chao Shih-Chieh
Huang Chih-Wen
Liao Chun-Lin
Jianq Chyun IP Office
Nguyen Hoa C
Tatung Company
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