Circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S763000, C361S766000, C174S261000, C174S262000

Reexamination Certificate

active

07609526

ABSTRACT:
A circuit board including a capacitor structure formed on a surface of an insulating substrate, wherein the capacitor structure includes paired linear conductive layers arranged on the surface of the insulating substrate, parallel to each other with a predetermined distance between them, and a dielectric material filled in a groove defined by those surfaces of the paired linear conductive layers which face each other and the surface of the insulating substrate.

REFERENCES:
patent: 3675095 (1972-07-01), Lehmann
patent: 4339668 (1982-07-01), Meuller et al.
patent: 4581301 (1986-04-01), Michaelson
patent: 4774634 (1988-09-01), Tate et al.
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5774341 (1998-06-01), Urbish et al.
patent: 6266227 (2001-07-01), Konushi et al.
patent: 6730573 (2004-05-01), Ng et al.
patent: 2002/0176989 (2002-11-01), Knudsen et al.
patent: 2003/0071349 (2003-04-01), Hirose
patent: 2003/0076660 (2003-04-01), Horie
patent: 2004/0160751 (2004-08-01), Inagaki et al.
patent: 2005/0047101 (2005-03-01), Osanai
patent: 2006/0050491 (2006-03-01), Hayashi et al.
patent: 196 33 923 (1998-02-01), None
patent: 2 371 053 (1978-06-01), None
patent: 811295 (1959-04-01), None
patent: 04-208591 (1992-07-01), None
patent: 5-500136 (1993-01-01), None
patent: 08-172029 (1996-07-01), None
patent: 09-092952 (1997-04-01), None
patent: 2004-296985 (2004-10-01), None
patent: WO 91/02647 (1991-03-01), None
“Decoupling Capacitor Incorporated in Printed Circuit Board” IBM Technical Disclosure Bulletin, IBM Corp. New York, US, vol. 33, No. 10A, Mar. 1, 1991, p. 424, XP0001100110; ISBN: 0018-8689.
Japanese Office Action dated Feb. 18, 2009 issued in a counterpart Japanese Application No. 2005-247930.

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