Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2004-11-19
2008-10-21
Lam, Cathy (Department: 1794)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S776000
Reexamination Certificate
active
07439625
ABSTRACT:
A circuit board (A1) includes an insulative substrate (1), a conductive pad (4a) formed on the substrate, and a metal (3) bonded to the pad via a solder layer (6). The metal piece (3) has a welding portion (3a) to which an external-connection terminal (5) is welded. A gap (7) is provided between the welding portion (3a) and the substrate (1). The welding portion (3a) and the solder layer (6) are separated by the gap (7).
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Kobayashi Hitoshi
Nagashima Mitsunori
Hamre Schumann Mueller & Larson P.C.
Lam Cathy
Rohm & Co., Ltd.
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