Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-03-15
1995-05-02
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, 174266, 361750, H05K 100
Patent
active
054121604
ABSTRACT:
A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.
REFERENCES:
patent: 4880567 (1989-11-01), Prabhu et al.
patent: 5225286 (1993-07-01), Fujikawa et al.
patent: 5258047 (1993-11-01), Tokisue et al.
IEICE, JPm. Technical Report, CPM91-75, Keiichiro Kata, et al., "Ultra-Low Dielectric Constant Multilayer Ceramic Substrate", pp. 7-12, 1991.
Am. Ceram. Soc., vol. 26, A. Das, et al., "A Morphological Study of Low-Dielectric-Permittivity Substrates for Packaging VLSIs", pp. 419-430, 1989.
Proc,. 39th Electric Components Conference, U. Mohideen, et al., "Ultra-Low Dielectric Permittivity Ceramics and Composites For High speed IC Packaging Applications", pp. 406-412, 1987.
Iwase Nobuo
Iyogi Kiyoshi
Koiwa Kaoru
Yamakawa Koji
Yasumoto Taka-aki
Figlin Cheryl R.
Kabushiki Kaisha Toshiba
Picard Leo P.
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