Circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

361398, 361411, H05K 105

Patent

active

046772529

ABSTRACT:
A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.

REFERENCES:
patent: Re39784 (1978-09-01), Chadwick et al.
patent: 3259805 (1966-07-01), Osipchak et al.
patent: 3296099 (1967-01-01), Dinella
patent: 3354542 (1967-11-01), Mallia
patent: 3932689 (1976-01-01), Watanabe et al.
patent: 3934334 (1976-01-01), Hanni
patent: 4212912 (1980-07-01), Wartusch et al.

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