Circuit assembly with vented solder pads

Details Circuit assembly with vented solder pads Circuit assembly with vented solder pads

1992-12-02

1995-05-30

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, 174262, 361767, 361808, 439 83, H05K 102

Patent

active

054203775

ABSTRACT:
A circuit assembly (100) includes a circuit carrier (102) and a solder pad (104). Circuit carrier (102) further includes at least one vent (108) formed in the circuit carrier (102) for venting gases developed during the process of soldering a component or contact (110) to solder pad (104). The one or more vents (108) prevent solder gases to get trapped in the solder joint during the soldering process. Without vent(s) (108) if the contact (110) to be mounted is substantially the size of the solder pad (104) or larger, gases would tend to be trapped and cause the solder joint to weaken.

REFERENCES:
patent: 4187388 (1980-02-01), Roberts
patent: 4336419 (1982-06-01), Wakayama et al.
patent: 4551788 (1985-11-01), Daniel et al.
patent: 4893216 (1990-01-01), Hagner

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