Circuit assembly with semiconductor expansion matched thermal pa

Details Circuit assembly with semiconductor expansion matched thermal pa Circuit assembly with semiconductor expansion matched thermal pa

1986-06-03

1987-10-13

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 70, 357 80, 357 81, 361400, 361421, H05K 720

Patent

active

047002735

ABSTRACT:
A copper lead frame (16) has an aperture (18) through which a molybdenum layer (20) extends to directly contact a ceramic substrate (8) therebelow. A semiconductor chip (2) is mounted on the molybdenum layer (20). Thermal conductivity is improved because of the reduced number of thermal path conduction layers between the semiconductor chip (2) and the ceramic substrate (8). The arrangement also enables the chip-expansion-matched thermal conductor (20) to contact the semiconductor chip (2) and match expansion therewith.

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