Circuit arrangement for multilayer printed circuit board

Details Circuit arrangement for multilayer printed circuit board Circuit arrangement for multilayer printed circuit board

1994-08-29

1996-03-05

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174262, 174264, 361792, H05K 102

Patent

active

054969719

ABSTRACT:
In a circuit arrangement for a multilayer printed circuit board, a first circuit layer is formed on a substrate, and comprises a dielectric layer having a circuit pattern formed thereon. A second circuit layer is further formed on the first circuit layer, and comprises a dielectric layer having a circuit pattern formed thereon. The first circuit pattern includes conductive segments having only an X-directional component, and the second circuit pattern includes conductive segments having only an Y-directional component perpendicular to the X-directional component. Electric connections between the X-directional segments and the Y-directional segments are suitably established by vias provided in the second layer. The first circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the X-directional segments, and the second circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the Y-directional segments. Electric connections between the slant segments of the first pattern and the slant segments of the second pattern are suitably established by vias provided in the second layer.

REFERENCES:
patent: 4791238 (1988-12-01), Kanno et al.
patent: 4859806 (1989-08-01), Smith
patent: 5360948 (1994-11-01), Thornberg
patent: 5360949 (1994-11-01), Duxbury
patent: 5438166 (1995-08-01), Carey et al.

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