Circuit arrangement

Details Circuit arrangement Circuit arrangement

2005-08-16

2005-08-16

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Bipolar transistor structure

With enlarged emitter area

C257S586000, C257S593000, C257S666000, C363S056020, C363S132000, C363S141000, C363S150000

Reexamination Certificate

active

06930373

ABSTRACT:
The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

REFERENCES:
patent: 4670833 (1987-06-01), Sachs
patent: 5274541 (1993-12-01), Kimura et al.
patent: 6160326 (2000-12-01), Iversen et al.
patent: 6166937 (2000-12-01), Yamamura et al.
patent: 6201701 (2001-03-01), Linden et al.
patent: 197 27 548 (1999-01-01), None
patent: 199 24 994 (2000-12-01), None
patent: 0 886 368 (1998-01-01), None

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