Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-04-26
2009-11-03
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S787000, C257S729000, C257S692000, C029S825000, C029S830000
Reexamination Certificate
active
07612445
ABSTRACT:
The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
REFERENCES:
patent: 6060774 (2000-05-01), Terui
patent: 6286207 (2001-09-01), Oura et al.
patent: 6613987 (2003-09-01), Seki et al.
patent: 2005-197648 (2005-07-01), None
Kohara Yasuhiro
Murai Makoto
Usui Ryosuke
Fish & Richardson P.C.
Rao Steven H
Sanyo Electric Co,. Ltd.
Weiss Howard
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