Electric heating – Heating devices – Combined with diverse-type art device
Patent
1996-09-10
1999-08-17
Leung, Philip H.
Electric heating
Heating devices
Combined with diverse-type art device
174 521, 257704, H05B 100, H02G 308, H01L 2312
Patent
active
059389567
ABSTRACT:
An inventive system for attaching a die to the die pad of a lead frame incorporates a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework. The resistive heating circuit is also incorporated into a Thin Small Outline Package (TSOP) between the TSOP's base and die cover. When the heating circuit in the TSOP heats up, it either cures an epoxy adhesive between the base and die cover to attach the die cover to the base, or it loosens the adhesive to detach the die cover from the base so a die inside the TSOP can be reworked. Thus, the inventive system eliminates the need for cumbersome curing ovens and, at the same time, provides a previously unavailable ability to rework certain semiconductor dice after they are packaged.
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Akram Salman
Hembree David R.
Leung Philip H.
Micro)n Technology, Inc.
Paik Sam
LandOfFree
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