Circuit analysis and manufacture using electric...

Details Circuit analysis and manufacture using electric... Circuit analysis and manufacture using electric...

2005-05-17

2005-05-17

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S750010, C382S145000

Reexamination Certificate

active

06894518

ABSTRACT:
Circuitry within a semiconductor die is analyzed by applying an electric field without necessarily directly accessing the circuitry. According to an example embodiment of the present invention, an electric field is applied to a semiconductor die and used to stimulate circuitry therein. A photoemission response of the die to the electric field is detected and used to detect an electrical characteristic of the die. This is particularly useful in applications where it is desired to direct stimulation to the die from an external source and to also externally detect a response of the die to the stimulation. In this manner, the die can be tested without necessarily directly contacting the die and, when the electric field is applied in a scanning mode over the die, can be effected without necessarily knowing the location of a defect in the die.

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