Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1996-04-09
1998-08-04
Gorgos, Kathryn L.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204297M, 279 3, 279128, 118DIG2, C25D 1704, C25D 1706, B23B 522, B23B 534
Patent
active
057888140
ABSTRACT:
The present invention relates to chucks and methods for positioning multiple objects, optionally for transport onto a recipient substrate. Instead of using conventional clamps that employ mechanical force, the present invention is directed to the use of a non-mechanical force such as negative pressure in a vacuum chuck, or static electricity in an electrostatic chuck as the force applied to the objects held by the chuck. Further, the chuck has a layer for holding the objects which are optionally subsequently transferred to a recipient substrate, the layer having a configuration substantially corresponding to the configuration of the recipient substrate. In certain aspects, the present invention is directed to a chuck for positioning objects with an average width or diameter less than or equal to one millimeter, and a thickness preferably less than about 3 millimeters, such as beads used in the chemical industry. In another aspect, the invention is directed to methods which involve the use of chucks, including methods for attracting an object or multiple objects, methods for positioning objects, methods for transporting objects, preferably substantially simultaneously, and methods of chemical manufacturing using the chucks.
REFERENCES:
patent: 1121452 (1914-12-01), Bagnall
patent: 4160257 (1979-07-01), Carrish
patent: 4332789 (1982-06-01), Mlodozeniec
patent: 4561688 (1985-12-01), Tsutsui
patent: 4652318 (1987-03-01), Masuda et al.
patent: 4917978 (1990-04-01), Ritt et al.
patent: 4921727 (1990-05-01), Datta et al.
patent: 4921767 (1990-05-01), Datta et al.
patent: 4925701 (1990-05-01), Jansen et al.
patent: 4971257 (1990-11-01), Birge
patent: 5028501 (1991-07-01), Ritt et al.
patent: 5080380 (1992-01-01), Nakagawa et al.
patent: 5278588 (1994-01-01), Kubelik
patent: 5499487 (1996-03-01), McGill
Donald A. Seanor, Triboelectrification of Polymers in K.C. Frisch and A. Patsis, Electrical Properties of Polymers (Technomic Publications, Westport, CT) pp. 37-58, Date unavailable.
Toshiya Watanabe et al., Electrostatic Force and Absorption Current of Alumina Electrostatic Chuck, Jpn. J. Appl. Phys. vol. 31, pp. 2145-2150 (1992), month unavailable.
Larry D. Harsough, Electrostatic Wafer Holding, Solid State Technology, pp. 87-90 (Jan. 1993).
John Field, Electrostatic Wafer Clamping for Next-Generation Manufacturing, Solid State Technology, pp. 91-98 (Sep. 1994).
J.-F. Daviet et al., Electrostatic Clamping Applied to Semiconductor Plasma Processing, I. Theoretical Modeling, J. Electrochem. Soc., vol. 140, No. 11, pp. 3245-3256 (Nov. 1993).
J.-F. Daviet et al., Electrostatic Clamping Applied to Semiconductor Plasma Processing, II. Experimental Results, J. Electrochem. Soc., vol. 140, No. 11, pp. 3256-3261 (Nov. 1993).
Peter Singer, Electrostatic Chucks in Wafer Processing, Semiconductor International, pp. 57-64 (Apr. 1995).
T. Watanabe et al., Electrostatic Charge Distribution in the Dielectric Layer of Alumina Electrostatic Chuck, Journal of Materials Science, vol. 29, pp. 3510-3616 (1994), Month unavailable.
Mamoru Nakasuji et al., Low Voltage and High Speed Operating Electrostatic Wafer Chuck Using Sputtered Tantalum Oxide Membrane, J. Vac. Sci. Technol. A 12(5) pp. 2834-2839 (Sep./Oct. 1994).
Knoedler Christina Marie
Steve Sun Hoi Cheong
Burke William J.
David Sarnoff Research Center
Gorgos Kathryn L.
Wong Edna
LandOfFree
Chucks and methods for positioning multiple objects on a substra does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chucks and methods for positioning multiple objects on a substra, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chucks and methods for positioning multiple objects on a substra will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1173288