Chuck transport method and system

Material or article handling – Apparatus for moving material between zones having different...

Reexamination Certificate

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Details

C414S149000, C414S222010, C414S222130, C414S223010, C414S804000, C414S805000, C414S939000

Reexamination Certificate

active

07066703

ABSTRACT:
A method and system for transporting a plurality of substrates between a transfer chamber and at least one processing chamber. The system includes a chuck assembly with a plurality of chucks configured to receive wafer substrates, where the chuck assembly is movably configured to provide for transfer of the plurality of substrates between a transfer chamber and a processing chamber. The system provides a structure that allows for the processing of one substrate on a first chuck, while a second substrate is loaded onto a second chuck and prepared for processing.

REFERENCES:
patent: 4886592 (1989-12-01), Anderle et al.
patent: 5183547 (1993-02-01), Ikeda
patent: 6048154 (2000-04-01), Wytman
patent: 6203677 (2001-03-01), Konig
patent: 6270582 (2001-08-01), Rivkin et al.
patent: 197 42 923 (1999-04-01), None
patent: 0 905 275 (1999-03-01), None

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