Chuck handling device

Metal working – Method of mechanical manufacture – Work holding

Patent

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Details

269 21, 198345, B23Q 700, B25B 1100, B65G 1564

Patent

active

045533113

ABSTRACT:
This invention is related to method and devices for applying and holding a wafer chuck assembly against an X, Y, .theta. alignment plate, said system including latching a wafer chuck assembly with a chuck handling device while inserting alignment pins carried by the device into corresponding V-like grooves in the chuck assembly to form a rigid unit, mounting the unit on pins extending from the X, Y, .theta. alignment plate, releasing the latching to allow the chuck assembly to fall downwardly a short distance until it rests on the X, Y, .theta. pins, and extending two pistons from the chuck handling device to engage the wafer chuck assembly to urge it snugly against the X, Y, .theta. alignment plate until the chuck assembly and alignment plate are locked together by vacuum means.

REFERENCES:
patent: 2969004 (1976-07-01), Schliemann
patent: 3990689 (1976-11-01), Eklund
patent: 4258928 (1981-03-01), Wiesler
patent: 4449885 (1984-05-01), Hertel et al.
patent: 4500032 (1985-02-01), Ackerman
patent: 4504045 (1985-03-01), Kenbo et al.

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