Chipset coupling apparatus

Details Chipset coupling apparatus Chipset coupling apparatus

2007-09-04

2007-09-04

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S688000, C361S807000

Reexamination Certificate

active

11130283

ABSTRACT:
A chipset coupling apparatus mounted onto a chipset-coupling seat of a printed circuit board includes a compression plate, which has an opening to allow a cooling section of a chipset to extend there through. The compression plate has anchor members on two opposite sides to latch on the chipset coupling seat. The compression plate can press the pin board of the chipset and enable the anchor members and the chipset coupling seat to form a latch relationship, so that a heat sink may be removed from the chipset, without removing the chipset at the same time, to avoid damage of the pins on the chipset.

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patent: 2004/0228095 (2004-11-01), Lee et al.

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