Chipset coupling apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S689000, C361S688000, C361S807000

Reexamination Certificate

active

11130283

ABSTRACT:
A chipset coupling apparatus mounted onto a chipset-coupling seat of a printed circuit board includes a compression plate, which has an opening to allow a cooling section of a chipset to extend there through. The compression plate has anchor members on two opposite sides to latch on the chipset coupling seat. The compression plate can press the pin board of the chipset and enable the anchor members and the chipset coupling seat to form a latch relationship, so that a heat sink may be removed from the chipset, without removing the chipset at the same time, to avoid damage of the pins on the chipset.

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patent: 6191480 (2001-02-01), Kastberg et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6205026 (2001-03-01), Wong et al.
patent: 6527577 (2003-03-01), Chen et al.
patent: 7074068 (2006-07-01), Ma
patent: 7101209 (2006-09-01), Yates et al.
patent: 2004/0228095 (2004-11-01), Lee et al.

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