Chiplid, multichip semiconductor package design concept

Details Chiplid, multichip semiconductor package design concept Chiplid, multichip semiconductor package design concept

1992-12-02

1994-04-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361767, 361809, 361810, 174 522, 174255, 257690, 439 69, 439 74, H05K 700

Patent

active

053072405

ABSTRACT:
An electronic package assembly which has a first electrical device mounted to a housing and a second electrical device attached to the lid of the package. The first and second devices are completely encapsulated by the lid and housing, and are typically coupled to a printed circuit board by pads on the bottom surface of the package. The electrical devices may be active or passive elements that are coupled together by conductive pads located on the top and bottom surfaces of the housing and lid, respectively. The conductive pads are typically soldered together when the lid is attached to the housing.

REFERENCES:
patent: 5157588 (1992-10-01), Kim et al.

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