Chip type thick film capacitor and method of making the same

Details Chip type thick film capacitor and method of making the same Chip type thick film capacitor and method of making the same

1996-02-16

1997-11-25

Ledynh, Bot L.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361303, 3613081, 361310, 29 2542, 437 51, 437 60, H01G 406, H01G 4005, H01G 4428, H01G 700

Patent

active

056918771

ABSTRACT:
A chip type thick film capacitor is provided which comprises an insulating chip (11) serving as a substrate and having a head surface (11a). The chip head surface (11a) is formed with a first lead electrode (12) and a second lead electrode (13) spaced from the first lead electrode (12). The chip head surface (11a) is also formed with a first capacitor electrode (14) in electrical conduction with the first lead electrode (12). The chip head surface (11a) is further formed with an auxiliary electrode (20) which is held in electrical conduction with the second lead electrode (13) but spaced from the first capacitor electrode (14) by a predetermined distance (D1). A dielectric layer (15) is formed on the first capacitor electrode (14), and a second capacitor electrode (16) is formed on the dielectric layer (15) in electrical conduction with the auxiliary electrode (20).

REFERENCES:
patent: 3490055 (1970-01-01), Cox
patent: 3949275 (1976-04-01), Muenz
patent: 4410867 (1983-10-01), Arcidiacono et al.
patent: 5420553 (1995-05-01), Sakamono et al.

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