Chip type solid electrolytic capacitor having a small size...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257SE23044, C257SE23124, C257S924000, C257S787000, C257S532000, C257S728000, C257S696000, C257S796000, C257S773000, C257S783000, C257S535000, C257S684000, C361S535000, C361S538000, C361S540000, C361S508000, C361S523000, C361S534000, C361S315000, C029S025420, C029S025030, C029S832000, C174S050510

Reexamination Certificate

active

07135754

ABSTRACT:
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

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