Chip-type solid electrolytic capacitor and method of manufacturi

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

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29 2503, 361529, 361533, H01G 905, H01G 924

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active

053900740

ABSTRACT:
A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.

REFERENCES:
patent: 3855505 (1974-12-01), Karlik, Jr. et al.
patent: 4093972 (1978-06-01), Voyles
patent: 4231075 (1980-10-01), Morimoto et al.
patent: 4247883 (1981-01-01), Thompson et al.
patent: 4561041 (1985-12-01), Crowley, Jr. et al.
patent: 5036434 (1991-07-01), Kobayashi
patent: 5254137 (1993-10-01), Mitani
Patent Abstracts of Japan, vol. 15, No. 428 (E-1128) 30 Oct. 1991 & JP-A-31 79 716 (Matsushita Electric Ind. Co.) 5 Aug., 1991.
Patent Abstracts of Japan, vol. 14, No. 584 (E-1018) 27 Dec. 1990 & JP-A-22 56 222 (Matsushita Electric Ind. Co.) 17 Oct. 1990.
Patent Abstracts of Japan, vol. 10, No. 121 (E-401) 7 May 1986 & JP-A-60 254 646 (Fujitsu KK) 16 Dec. 1985.

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