Chip-type solid electrolytic capacitor and method of...

Details Chip-type solid electrolytic capacitor and method of... Chip-type solid electrolytic capacitor and method of...

2006-11-21

2006-11-21

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With housing mount

C257S658000, C257S777000, C257S732000, C029S025030, C361S271000

Reexamination Certificate

active

07138713

ABSTRACT:
A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a solder or a conductive adhesive. The cathode terminal is provided with a through hole formed at a portion to be brought into contact with each of the capacitor elements. Bonding surfaces of the capacitor elements are directly connected at the through hole.

REFERENCES:
patent: 5198967 (1993-03-01), Kuranuki et al.
patent: 6343044 (2002-01-01), Hsu et al.
patent: 2001-284192 (2001-10-01), None
patent: 2004-363526 (2004-12-01), None
patent: 10-0191759 (1999-06-01), None

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